Chongqing
Research R&D Achievements
Take "More than Moore + opto-electronics integration" technical route, with siliconphotonics, heterogeneous 3D integration, CIS ,SmartSensing and other technology and product technology as the core, drive the industrial development, and form a whole industrial chain.
united
Cooperation Joint Innovation
"Collaborative innovation, mutual development", building innovationconsortium with the domestic and foreign universities and enterprise, with major projects as the link to form a deeply integrated team, to gradually form an innovationeco-chain which takes Chongqing as the core,Hong Kong subsidiary as the support, universities as innovationconsortium including Hong Kong University of Science and Technology, Chinese University of Hong Kong,University of Macau and University of Singapore, Belgium representative office as the node, and keep integrative development with domestic universities.
  • CUMEC sets research and development centers in Hongkong and Belgium
Micro
Technology Process Platform
It is planned to invest 10 billion yuan to build an international 8-inch process platform in this field in 2019, a world-class 12-inch high-end characteristic process platform in this field in 2021, and a state-level and world-class innovation center in 2020.
8-inchprocess platform
Center
Elite Elite Talents
R&D Achievements
Take "More than Moore + opto-electronics integration" technical route, with siliconphotonics, heterogeneous 3D integration, CIS ,SmartSensing and other technology and product technology as the core, drive the industrial development, and form a whole industrial chain.
Silicon Photonics R&D Center
3D Integration & Microsystem Center
Intelligent sensing R&D Center
AI Chip & System Center
Joint Innovation
"Collaborative innovation, mutual development", building innovationconsortium with the domestic and foreign universities and enterprise, with major projects as the link to form a deeply integrated team, to gradually form an innovationeco-chain which takes Chongqing as the core,Hong Kong subsidiary as the support, universities as innovationconsortium including Hong Kong University of Science and Technology, Chinese University of Hong Kong,University of Macau and University of Singapore, Belgium representative office as the node, and keep integrative development with domestic universities.
Process PlatformMore
It is planned to invest 10 billion yuan to build an international 8-inch process platform in this field in 2019, a world-class 12-inch high-end characteristic process platform in this field in 2021, and a state-level and world-class innovation center in 2020.
Elite TalentsMore
Cooperation Platform
WeChat Official Account
Chongqing Integrated Circuit Characteristic Process, Packaging and Test Union
CUMEC insists combing independent R & D and collaborative innovati...